Semiconductor

  Market Highlights The demand low power consumption, high bandwidth, and highly scalable memory devices are driving the demand for hybrid memory cube and high-bandwidth memory market. The ever-growing data and the rising demand for cloud-based services are fuelling the market growth. However, the thermal issues caused due to integration of these devices are hindering the market growth. The global  HMC and HBM Market  is expected to reach USD 3.7 billion at CAGR 35% through the forecast period 2023 Key Players Some of the key players in the global hybrid memory cube and high-bandwidth memory market are IBM Corporation (U.S.), Micron Technology, Inc.(U.S.), Samsung Group (South Korea), SK Hynix Inc. (South Korea), Advanced Micro Devices, Inc. (U.S.), Intel Corporation (U.S.), Xilinx, Inc.(US.), Fujitsu Ltd.(Japan), Nvidia Corporation (U.S.), Open-Silicon (U.S.) and many others. Some of the key innovators in the area of hybrid memory cube and high-bandwidth memory market ar...