Semiconductor

  Industry Insight Flip-chip refers to semiconductors that are mounted with the active side down. Flip chip assembly offers many advantages. A key advantage is improved electrical performance. The small bumps of flip chip interconnection provide short electrical paths, which yield excellent electrical properties with low capacitance, inductance, and resistance. This results in greatly improved high-frequency performance compared to other interconnection methods such as chip-and-wire. Another important advantage of flip-chip assembly is its compactness. The electrical connection pads on the chip and substrate surfaces can be laid out as an area array, rather than around the periphery of the chip. This 2D-array structure can save chip space and reduce the footprint of the chip on the substrate. Flip chip assembly has gained acceptance in a wide range of low-end and high-end electronic products. Miniaturization, enhanced the electrical performance, and high interconnection density are...

  Market Research Future published a research report on “Flip Chip Technology Market Research Report - Global Forecast till 2027” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2027. Industry Insights The surge in the use of electronics in almost every domain is expected to boost the flip chip technology market 2020. The semiconductor and electronics industry reports are produced by Market Research Future, which highlights market options for expansion. An 8.29 % CAGR is estimated to lift the growth of the flip chip technology market in the impending period. The increasing usage of the micro-electromechanical system (MEMS) is estimated to usher in new opportunities for the flip chip market. Moreover, the need to improve the reliability of circuits is predicted to reform the flip chip technology market in the future. Segmental Analysis The evaluation of the segments of the  Flip Chip Technology Market  is conducted on the basis of packaging type, packagin...